TSMC HAS REVEALED A FURTHER YEAR of its production roadmap at the North American Technology Symposium. N2 is on schedule for production in 2025, with two further iterations after. It brings a 10-15 percent speed improvement at the same power level, and a 25-30 percent power reduction at the same speed. Despite what the numbers suggest, chip density is 1.15 times. That metric doesn’t equate directly to the size of the transistor gates, although each manufacturer measures things differently. The second-generation N2P is due in 2026, reaching customers in 2027. This uses backside power delivery (don’t laugh), splitting signal and power between the front and back interconnects. This enables sizable bumps in transistor density, plus power savings. Intel is working on this too, and plans to get it running by 2025.