Apple’s introduction of M4 chips is still fresh in the mind, but attention is already turning to M5, which we’re likely to see this year. The company hasn’t revealed any details, but the expectation is that the next–generation will continue to be a 3nm chip. It is likely to be manufactured using TSMC’s N3P process node which, without getting technical, offers a 5% higher speed, up to 10% lower power (thereby lending better battery life), and 1.04 times higher chip density.
The standard M5 is due to be released first in the MacBook Pro, iPad Pro, and potentially the Mac mini. The M5 Pro, M5 Max, and M5 Ultra will follow. That is where we will see greater innovation. Analyst Ming–Chi Kuo says these chips will utilize server–grade, 2.5D SoIC– mH (System on Integrated Chips– Molding Horizontal) packaging. The CPU and GPU will be separated to improve thermal performance, unlike in the M4, where the elements are together. It will use up to 50% less space than System– on–Chip designs, and be so advanced that the M5 Pro may be used in Apple Intelligence servers, as well as for Private Cloud Compute infrastructure.